Dow Corning TC-5888 Thermally Conductive Compound 1kg Thermal Paste Silicone Grease Gray for Computer Cooling MPU CPU GPU PCB Assembly Electrical Device Thixotropic Non Curing

Dow Corning TC-5888 Thermally Conductive Compound 1kg one Bucket Grey Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules. Uses Dow Corning TC-5888 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules Benefits One-Part Material: No cure is required when applying the material. Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces. Thermal Stability: Delivers consistent performance and reliability under high temperatures. Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall. Composition Thermally conductive fillers Siloxane polymer matrix Color: Gray One Part Material: Non-curing Viscosity At Low Strain Rate: 1,200 Pa·s Viscosity At High Strain Rate: 100 Pa·s Specific Gravity: 2.6 Volatile Content, 48 hours at 125°C: 0.02 % Thermal Conductivity: 5.2 W/mK Thermal Resistance at 25 N/cm²: 0.05 °C·cm²/W Bond Line Thickness at 25 N/cm²: 0.02 mm, 0.0008 inch Suitable for LED Lighting, DT, NB, VGA, IPC, CPU, GPU, IC, Chipset

• Dow Corning TC-5888 Thermally Conductive Compound, 1kg one Bucket. Thermal Paste Silicone Grease. Computer & Electrical Device Cooling. Thixotropic, Non-Curing. Gray.
• Color: Gray. One Part Material: Non-curing. Viscosity At Low Strain Rate: 1,200 Pa·s. Viscosity At High Strain Rate: 100 Pa·s. Specific Gravity: 2.6. Volatile Content, 48 hours at 125°C: 0.02 %. Thermal Conductivity: 5.2 W/mK. Thermal Resistance at 25 N/cm²: 0.05 °C·cm²/W. Bond Line Thickness at 25 N/cm²: 0.02 mm, 0.0008 inch. Composition: Thermally conductive fillers, Siloxane polymer matrix.
• Designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules. CPU, GPU, PCB Assembly, LED Lighting, DT, NB, VGA, IPC, IC, Chipset
• Solvent free formulation. Excellent Stay-ability. Thermal Stability. Good Processability. Thixotropic. High thermal conductivity. One part material. Easy application. Achieves thin Bond Line Thickness (BLT).